- Pure silver conductor
- Air-helix structure
- Air dielectric ensures extremely low capacitance
- Cross Link Super Speed waveguide technology
- Double Layer Multicore
- Directly crimped connectors (1.5 T pressure)
- 纯银导体
- 气螺旋结构
- 空气电介质可确保极低的电容
- 交叉链接超高速波导技术
- 双层多核
- 直接压接的连接器(1.5 T压力)